Availability: In Stock

ELECTRONICS PACKAGING FORUM: MULTICHIP MODULE TECHNOLOGY ISSUES (HB) 

Author: MORRIS
SKU: 52227

25,420

Only 1 left in stock

Category:

Description

ISBN: 9780780304390

Code: 52227

Author: MORRIS 

Pubsliher: IEEE PRESS

Year: 1994

Additional information

Author

Publisher

Year